The syringe packaging enables convenient, controlled application of the paste exactly where needed—without mess or waste.
The paste requires no curing. It reaches full thermal performance from the very first usage cycle.
The electrically non-conductive and non-corrosive compound minimizes the risk of short circuits and protects your components.
The Natec Husky Pack thermal paste is a reliable choice for processors, graphics cards, and other components where stable heat dissipation is crucial. Thanks to low thermal resistance, it ensures rapid heat transfer to the heatsink, helping maintain lower operating temperatures and higher performance.
The paste is electrically non-conductive and chemically stable, minimizing the risk of shorts and corrosion. It delivers full effectiveness immediately after application—no curing time needed. The ergonomic syringe makes dosing easy, even across multiple installations.
