ASRock Taichi X870E Motherboard (AM5, DDR5, M.2, E-ATX)
ASRock Taichi X870E Motherboard (AM5, DDR5, M.2, E-ATX)
Blazing M.2 with PCIe 5.0: ready for the fastest SSDs
Blazing M.2 slots with PCIe 5.0 deliver up to double the bandwidth of PCIe 4.0 and unlock the potential of cutting-edge NVMe drives for lightning-fast loading and data workflows.
USB4 Type‑C and 5GbE LAN for maximum connectivity
USB4 offers transfers up to 40 Gb/s and universal compatibility, while 5GbE LAN with EMI resilience ensures a fast and stable wired network for work and play.
Stable power delivery and composite VRM cooling
Premium 20K capacitors (1000 µF) reduce ripple and improve stability. The composite VRM heatsink with a passive block, heatpipe and fan keeps temperatures in check even under heavy load.
ASRock Taichi X870E pushes performance boundaries for AMD Ryzen processors on the AM5 socket. An 8-layer, low-loss, server-grade PCB improves signal integrity, enabling full utilization of PCIe 5.0 for both the graphics card and M.2 SSDs. Premium 20K capacitors with 1000 µF capacity reduce ripple, stabilize output current and enhance overall system reliability.
The board is built for the future of connectivity: USB4 Type‑C for transfers up to 40 Gb/s, Wi‑Fi 7 (802.11be) with lower latency and multi‑link operation, and 5GbE LAN with EMI resistance. Composite VRM cooling combines a larger aluminum heatsink, heatpipe and active fan for efficient heat dissipation under load. Support for DDR5 with XMP/EXPO profiles makes it easy to reach higher frequencies and stable memory tuning.
- PCIe 5.0 for GPU and Blazing M.2 – double the bandwidth over the previous generation
- USB4 Type‑C (40 Gb/s) – universal, ultra-fast connectivity
- Wi‑Fi 7 + 5GbE LAN – best-in-class wireless and wired networking
- Composite VRM cooling – stability and performance even when overclocking
- 8-layer server-grade PCB – better signal integrity and lower temperatures
Specifications
- Socket
- AMD AM5
- Chipset
- AMD X870E
- Form factor
- E-ATX
- Memory
- DDR5
- Number of DIMM slots
- 4
- Memory profile support
- Intel XMP, AMD EXPO
- Graphics interface
- PCI Express 5.0
- M.2 storage
- Blazing M.2 (PCIe 5.0)
- Wired network
- 5GbE LAN (EMI resistance)
- Wireless network
- Wi‑Fi 7 (802.11be)
- USB
- USB4 Type‑C (up to 40 Gb/s)
- PCB construction
- 8-layer, low-loss, server-grade
- Inner PCB layers
- reinforced copper layers
- Power delivery
- premium 20K capacitors, 1000 µF capacity
- VRM cooling
- composite heatsink with fan and heatpipe
