QIDI Q2 is a powerful FDM 3D printer with CoreXY kinematics, offering a large build volume of 270 × 270 × 256 mm, speeds up to 600 mm/s, and acceleration up to 20,000 mm/s². Thanks to the enclosed actively heated chamber (up to 65 °C), a hotend up to 370 °C, and smart features such as automatic leveling with no offset tuning and AI print monitoring, it’s an excellent choice for reliable printing from PLA all the way to demanding engineering materials.
QIDI Q2 is designed for users who want a combination of high speed, accuracy, and stability for everyday printing. The CoreXY architecture, together with linear rails and a rigid metal frame, minimizes play and vibrations, so the printer maintains precise performance over the long term even under heavier use.
For an easy start and consistent results, it uses a leveling system that uses the nozzle as a sensor—without manual offset adjustment. This provides a reliable first layer, better adhesion, and higher repeatability, especially on larger models. Surface quality is further supported by resonance control and an improved 1.5GT belt, which help reduce wall rippling and visible layer artifacts.
Main advantages of the QIDI Q2:
- Fast printing up to 600 mm/s and acceleration up to 20,000 mm/s² for shorter production times.
- High-temperature hotend up to 370 °C and a heated chamber up to 65 °C for ABS, ASA, PC, and composites.
- Durable bimetal nozzle made of hardened steel and a dual-gear extruder drive for stable filament feeding.
- AI camera for monitoring and detecting “spaghetti” failures, with the option to auto-pause.
- 3-in-1 filtration (G3 + HEPA H12 + activated carbon) to reduce dust and odors in the room.
- NFC for recognizing compatible filaments and easier print setup.
- Operational protections including filament runout detection and optional tangle detection (via QIDI BOX – optional).
Specifications
- Manufacturer
- QIDI
- Model
- Q2
- Printing technology
- FDM
- Kinematics
- CoreXY
- Build volume
- 270 × 270 × 256 mm
- Print speed
- up to 600 mm/s
- Acceleration
- up to 20,000 mm/s²
- Nozzle temperature
- up to 370 °C
- Chamber temperature
- up to 65 °C (active heating)
- Supported materials
- PLA, PETG, ABS, ASA, PC, and composite materials (e.g., carbon fiber, glass fiber)
- Connectivity and interfaces
- Wi‑Fi 2.4 GHz, Ethernet, USB (file transfer and updates)
- Device dimensions
- 402 × 438 × 494 mm
- Weight
- 25 kg
