The SAVIO TG-01 thermal paste (2 g) provides reliable heat transfer between the processor and heatsink thanks to carbon micro-particles. It is non-conductive, safe for electronics, easy to apply, and suitable for repeated use thanks to the practical syringe.
SAVIO TG-01 is a quality thermal paste with carbon micro-particles that perfectly fills microscopic gaps between the CPU IHS and the heatsink base. As a result, it maintains stable temperatures and helps keep the computer quiet yet high-performing.
The metal-oxide-free formula is electrically non-conductive, minimizing the risk of short circuits and reducing the chance of corrosion. The well-balanced viscosity enables easy and clean application even for beginners—syringe packaging allows precise dosing and the included spatula helps spread it evenly. The paste is available in various weights for single-use or repeated applications.
- Excellent gap filling for efficient heat transfer
- Safe composition without metal oxides—does not conduct electricity
- Easy application thanks to optimal consistency, syringe, and spatula
- Reusable—packaging prevents the paste from drying out
Specifications
- Brand / model
- SAVIO TG-01
- Filling weight
- 2 g
- Thermal conductivity
- 4.7 W/m·K
- Composition
- Carbon micro-particles, no metal oxides
- Electrical conductivity
- Non-conductive
- Packaging form
- Syringe with spatula
- Recommended use
- CPU / GPU and heatsinks
- Features
- Easy application, reusable, reduces corrosion
