The high-performance motherboard ASROCK Phantom Gaming B850 Riptide WiFi for the AMD AM5 platform delivers stable power with 14+2+1 phases, support for DDR5 with XMP/EXPO profiles, fast USB 3.2 Gen2x2 Type‑C connectivity, and thoughtful cooling. An ideal choice for gamers and enthusiasts seeking reliability, performance, and overclocking potential in the ATX form factor.
14+2+1 phase power with Dr.MOS for stable performance
A powerful VRM with integrated Dr.MOS stages ensures smooth CPU power delivery, lower heat, and reliability for both gaming and overclocking.
8-layer PCB and Hi‑Density connectors for maximum stability
The multilayer PCB improves signal integrity and reduces temperatures. Hi‑Density power connectors handle higher currents and increase safety even under intense OC.
Fast USB 3.2 Gen2x2 Type‑C up to 20 Gb/s
The modern front‑panel USB‑C connector offers double the speed versus Gen2 and convenient reversible plug‑in for your high‑speed storage and peripherals.
Built on a robust 14+2+1 power stage and integrated Dr.MOS, the B850 Riptide WiFi provides smooth, cool power delivery even under heavy loads. Hi‑Density power connectors and an 8‑layer PCB boost stability, lower temperatures, and open headroom for safe overclocking.
Memory support includes DDR5 with Intel XMP / AMD EXPO profiles for easy, reliable frequency tuning. On the front panel you’ll appreciate modern USB 3.2 Gen2x2 Type‑C with speeds up to 20 Gb/s. The board is designed for gaming builds with an emphasis on stability, longevity, and high performance.
- Stable power: 14+2+1 phases with Dr.MOS for efficient thermals and OC headroom.
- Premium 20K 1000 μF capacitors: lower ripple, steadier output, and higher reliability.
- 8‑layer PCB: better signal integrity, lower temps, higher efficiency.
- DDR5 XMP/EXPO: straightforward memory tuning and maximum performance.
- USB‑C Gen2x2 20 Gb/s: twice the speed over the previous generation, reversible connector.
Specifications
- CPU socket
- AMD AM5
- Motherboard form factor
- ATX
- Chipset
- AMD B850
- Power delivery
- 14+2+1 phases, Dr.MOS
- VRM and power
- Hi‑Density power connectors for higher current
- PCB
- 8‑layer printed circuit board
- Memory
- DDR5, support for Intel XMP and AMD EXPO profiles
- Front panel I/O
- USB 3.2 Gen2x2 Type‑C (up to 20 Gb/s)
- Capacitors used
- Exclusive 20K, 1000 μF for lower ripple and stability
- Target use
- Gaming and high‑performance builds, overclocking
